Arctic MX-6 (8 g) Thermal Compound Paste for CPU Consoles Laptops ACTCP00081A

SIMPLY THE PASTE

The ARCTIC MX-6 is a carbon filler-based thermal paste and reaches its maximum performance without burn-in, directly after application and distribution. It achieves all of this without any reputed ingredients, such as expensive diamond dust or various precious metal particles. The silicone gel used as a carrier enables optimal distribution, which is achieved through even contact pressure, for example when mounting the heat sink.

20 % BETTER PERFORMANCE

With its improved composition, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The basis for calculation is the temperature difference between the cooler base and the heat source (in C) in relation to the applied heat load (in W), which also results in the unit C/W. The higher the thermal resistance, the worse the heat can be transferred through the TIM layer. Thermal insulators, as an example, therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low one.

PROVEN QUALITY

VERSATILE RANGE OF APPLICATIONS

With its new composition, MX-6 is the suitable thermal compound for many application scenarios. Excellent non-drying and non-bleeding properties ensure consistent long-term performance. Its viscosity prevents leakage due to the pump-out effect. It's also suitable for direct-die cooling scenarios which occur, for example, with graphics cards or console processor GPUs.

OFTEN COPIED, BUT NEVER EQUALED

EASY APPLICATION

MX-6 is neither electrically conductive nor capacitive. This eliminates the risk of short circuits or discharges, which can cause serious damage to components if care is not taken. The thermal paste is also free of liquid metal components, which can often lead to discoloration, abrasion or corrosion damage to the radiator bottom.

AVAILABLE IN SEVERAL VERSIONS

ARCTIC MX-6 is available in package sizes from 2 to 8 grams. Resealable syringes prevent the paste from drying out and facilitate…